F4BTMS255 2-Layer 1.6mm PCB – 60mil Ceramic-Filled PTFE with Immersion Gold for Aerospace & RF
1.Introduction to F4BTMS255 2-Layer 1.6mm PCB
The F4BTMS series represents an upgraded version of the F4BTM series, achieving significant technological breakthroughs in material formulation and manufacturing processes. Enriched with substantial ceramic content and reinforced with ultra-thin, ultra-fine glass fiber cloth, this material demonstrates substantial performance improvements and offers a broader range of dielectric constants. As a high-reliability material suitable for aerospace applications, it can effectively replace similar imported products.
By incorporating minimal ultra-thin glass fiber cloth and large amounts of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the material minimizes the negative effects of glass fiber on electromagnetic wave propagation. This innovative composition reduces dielectric loss, enhances dimensional stability, decreases X/Y/Z anisotropy, expands usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics.
The F4BTMS series features RTF low roughness copper foil as standard, which reduces conductor loss while maintaining excellent peel strength, and is compatible with both copper and aluminum bases.
2.Key Features (F4BTMS255)
Dielectric constant (Dk) of 2.55 ±0.04 at 10GHz
Dissipation factor of 0.0012 at 10GHz, 0.0013 at 20GHz
CTE: x-axis 15 ppm/°C, y-axis 20 ppm/°C, z-axis 80 ppm/°C (-55°C to 288°C)
Low thermal coefficient of Dk: -92 ppm/°C (-55°C to 150°C)
UL-94 V0 flammability rating
Low moisture absorption: 0.025%
RTF low roughness copper foil standard
3.Benefits
Minimal electromagnetic wave propagation interference
Reduced dielectric loss and enhanced dimensional stability
Excellent thermal and electrical performance
Suitable for high-reliability aerospace applications
Compatible with domestic manufacturing processes
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | F4BTMS255 |
| Layer Count | Double Sided |
| Board Dimensions | 87mm × 80mm (±0.15mm) |
| Min. Trace/Space | 5 mil / 7 mil |
| Min. Hole Size | 0.3 mm |
| Blind Vias | No |
| Finished Board Thickness | 1.6 mm |
| Finished Cu Weight | 1 oz |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 - 35 μm
F4BTMS255 Core - 1.524 mm (60mil)
Copper_layer_2 - 35 μm
6.PCB Statistics:
Components: 28
Total Pads: 65
Thru Hole Pads: 44
Top SMT Pads: 21
Bottom SMT Pads: 0
Vias: 41
Nets: 2
7.Typical Applications
Aerospace equipment and space cabin systems
Microwave and RF circuits
Radar and military radar systems
Feed networks
Phase-sensitive antennas and phased array antennas
Satellite communications
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
